Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/601895
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dc.coverage.spatial
dc.date.accessioned2024-11-20T05:36:22Z-
dc.date.available2024-11-20T05:36:22Z-
dc.identifier.urihttp://hdl.handle.net/10603/601895-
dc.description.abstractnewline
dc.format.extentxxvi, 128
dc.languageEnglish
dc.relation
dc.rightsuniversity
dc.titleSignal integrity assessment of through package multibit vias in glass interposers for 3d integration
dc.title.alternative
dc.creator.researcherKumar, Ajay
dc.subject.keywordEngineering
dc.subject.keywordEngineering and Technology
dc.subject.keywordEngineering Electrical and Electronic
dc.description.note
dc.contributor.guidePrakash, Jai
dc.publisher.placeHamirpur
dc.publisher.universityNational Institute of Technology Hamirpur
dc.publisher.institutionDepartment of Electronics and Communication Engineering
dc.date.registered2019
dc.date.completed2024
dc.date.awarded2024
dc.format.dimensions
dc.format.accompanyingmaterialDVD
dc.source.universityUniversity
dc.type.degreePh.D.
Appears in Departments:Department of Electronics and Communication Engineering

Files in This Item:
File Description SizeFormat 
01_title.pdfAttached File217.71 kBAdobe PDFView/Open
02_prelim pages.pdf7.25 MBAdobe PDFView/Open
03_content.pdf234.57 kBAdobe PDFView/Open
04_abstract.pdf193 kBAdobe PDFView/Open
05_chapter 1.pdf1.48 MBAdobe PDFView/Open
06_chapter 2.pdf2.53 MBAdobe PDFView/Open
07_chapter 3.pdf3.3 MBAdobe PDFView/Open
08_chapter 4.pdf1.86 MBAdobe PDFView/Open
09_chapter 5.pdf3.9 MBAdobe PDFView/Open
10_chapter 6.pdf302.38 kBAdobe PDFView/Open
11_annexures.pdf328.17 kBAdobe PDFView/Open
80_recommendation.pdf4.55 MBAdobe PDFView/Open


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