Shodhganga : a reservoir of Indian theses @ INFLIBNET
The Shodhganga@INFLIBNET Centre provides a platform for research students to deposit their Ph.D. theses and make it available to the entire scholarly community in open access.
Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/601895
| Title: | Signal integrity assessment of through package multibit vias in glass interposers for 3d integration |
| Researcher: | Kumar, Ajay |
| Guide(s): | Prakash, Jai |
| Keywords: | Engineering Engineering and Technology Engineering Electrical and Electronic |
| University: | National Institute of Technology Hamirpur |
| Completed Date: | 2024 |
| Abstract: | newline |
| Pagination: | xxvi, 128 |
| URI: | http://hdl.handle.net/10603/601895 |
| Appears in Departments: | Department of Electronics and Communication Engineering |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 01_title.pdf | Attached File | 217.71 kB | Adobe PDF | View/Open |
| 02_prelim pages.pdf | 7.25 MB | Adobe PDF | View/Open | |
| 03_content.pdf | 234.57 kB | Adobe PDF | View/Open | |
| 04_abstract.pdf | 193 kB | Adobe PDF | View/Open | |
| 05_chapter 1.pdf | 1.48 MB | Adobe PDF | View/Open | |
| 06_chapter 2.pdf | 2.53 MB | Adobe PDF | View/Open | |
| 07_chapter 3.pdf | 3.3 MB | Adobe PDF | View/Open | |
| 08_chapter 4.pdf | 1.86 MB | Adobe PDF | View/Open | |
| 09_chapter 5.pdf | 3.9 MB | Adobe PDF | View/Open | |
| 10_chapter 6.pdf | 302.38 kB | Adobe PDF | View/Open | |
| 11_annexures.pdf | 328.17 kB | Adobe PDF | View/Open | |
| 80_recommendation.pdf | 4.55 MB | Adobe PDF | View/Open |
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