Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/589125
Title: | A study on the influence of void and moisture contents of some building materials on their thermal transport properties and implications on thermal performance of building envelops |
Researcher: | Bhattacharjee, B. |
Guide(s): | Krishnamoorthy, S |
Keywords: | Engineering and Technology Material Science Materials Science Multidisciplinary |
University: | Indian Institute of Technology Delhi |
Completed Date: | 1989 |
Abstract: | Abstract Available |
Pagination: | NA |
URI: | http://hdl.handle.net/10603/589125 |
Appears in Departments: | Department of Materials Science and Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 24.75 kB | Adobe PDF | View/Open |
02_prelim pages.pdf | 285 kB | Adobe PDF | View/Open | |
03_content.pdf | 223.21 kB | Adobe PDF | View/Open | |
04_abstract.pdf | 88.92 kB | Adobe PDF | View/Open | |
05_chapter 1.pdf | 187.6 kB | Adobe PDF | View/Open | |
06_chapter 2.pdf | 1.96 MB | Adobe PDF | View/Open | |
07_chapter 3.pdf | 1.19 MB | Adobe PDF | View/Open | |
08_chapter 4.pdf | 673.83 kB | Adobe PDF | View/Open | |
09_chapter 5.pdf | 1.87 MB | Adobe PDF | View/Open | |
10_chapter 6.pdf | 366.35 kB | Adobe PDF | View/Open | |
11_chapter 7.pdf | 187.77 kB | Adobe PDF | View/Open | |
12_annexures.pdf | 1.18 MB | Adobe PDF | View/Open | |
80_recommendation.pdf | 210.63 kB | Adobe PDF | View/Open |
Items in Shodhganga are licensed under Creative Commons Licence Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0).
Altmetric Badge: