Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/581532
Title: Envelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warming
Researcher: Ukey, Rahul
Guide(s): Rai, Aakash Chand and Yadav, Shyam Sunder
Keywords: Engineering
Engineering and Technology
Engineering Mechanical
University: Birla Institute of Technology and Science
Completed Date: 2023
Abstract: newline
Pagination: 
URI: http://hdl.handle.net/10603/581532
Appears in Departments:Mechanical Engineering

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01_title.pdfAttached File117.06 kBAdobe PDFView/Open
02_prelim pages.pdf231.4 kBAdobe PDFView/Open
03_content.pdf136.37 kBAdobe PDFView/Open
04_abstract.pdf101.36 kBAdobe PDFView/Open
05_chapter1.pdf188.97 kBAdobe PDFView/Open
06_chapter2.pdf173.72 kBAdobe PDFView/Open
07_chapter3.pdf715.47 kBAdobe PDFView/Open
08_chapter4.pdf919.34 kBAdobe PDFView/Open
09_chapter5.pdf1.1 MBAdobe PDFView/Open
10_chapter6.pdf136.46 kBAdobe PDFView/Open
11_annexure.pdf4.19 MBAdobe PDFView/Open
80_recommendation.pdf163.72 kBAdobe PDFView/Open
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