Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/567212
Title: | An Investigation of WEDM process of doped silicon semi conductor wafer slicing through response surface methodology |
Researcher: | Singh, Raminder |
Guide(s): | Kumar, Anish |
Keywords: | Engineering Engineering and Technology Engineering Mechanical |
University: | Maharishi Markandeshwar University, Mullana |
Completed Date: | 2024 |
Abstract: | Included |
Pagination: | |
URI: | http://hdl.handle.net/10603/567212 |
Appears in Departments: | Department of Mechanical Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 127.42 kB | Adobe PDF | View/Open |
02_prelim_pages.pdf | 239.47 kB | Adobe PDF | View/Open | |
03_contents.pdf | 249.12 kB | Adobe PDF | View/Open | |
04_abstract.pdf | 91.03 kB | Adobe PDF | View/Open | |
05_chapter1.pdf | 381.97 kB | Adobe PDF | View/Open | |
06_chapter2.pdf | 295.24 kB | Adobe PDF | View/Open | |
07_chapter3.pdf | 515.45 kB | Adobe PDF | View/Open | |
08_chapter4.pdf | 1.21 MB | Adobe PDF | View/Open | |
09_chapter5.pdf | 2.12 MB | Adobe PDF | View/Open | |
10_conclusion.pdf | 227.04 kB | Adobe PDF | View/Open | |
11_annexures.pdf | 417.24 kB | Adobe PDF | View/Open | |
80_recommendation.pdf | 1.15 MB | Adobe PDF | View/Open |
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