1. Shodhganga@INFLIBNET
  2. Maharishi Markandeshwar University, Mullana
  3. Department of Mechanical Engineering
Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/567212
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DC FieldValueLanguage
dc.coverage.spatial
dc.date.accessioned2024-05-28T10:25:32Z-
dc.date.available2024-05-28T10:25:32Z-
dc.identifier.urihttp://hdl.handle.net/10603/567212-
dc.description.abstractIncluded
dc.format.extent
dc.languageEnglish
dc.relation
dc.rightsuniversity
dc.titleAn Investigation of WEDM process of doped silicon semi conductor wafer slicing through response surface methodology
dc.title.alternative
dc.creator.researcherSingh, Raminder
dc.subject.keywordEngineering
dc.subject.keywordEngineering and Technology
dc.subject.keywordEngineering Mechanical
dc.description.noteBibliography p. 86-96
dc.contributor.guideKumar, Anish
dc.publisher.placeMullana- Ambala
dc.publisher.universityMaharishi Markandeshwar University, Mullana
dc.publisher.institutionDepartment of Mechanical Engineering
dc.date.registered2015
dc.date.completed2024
dc.date.awarded2024
dc.format.dimensions
dc.format.accompanyingmaterialNone
dc.source.universityUniversity
dc.type.degreePh.D.
Appears in Departments:Department of Mechanical Engineering

Files in This Item:
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01_title.pdfAttached File127.42 kBAdobe PDFView/Open
02_prelim_pages.pdf239.47 kBAdobe PDFView/Open
03_contents.pdf249.12 kBAdobe PDFView/Open
04_abstract.pdf91.03 kBAdobe PDFView/Open
05_chapter1.pdf381.97 kBAdobe PDFView/Open
06_chapter2.pdf295.24 kBAdobe PDFView/Open
07_chapter3.pdf515.45 kBAdobe PDFView/Open
08_chapter4.pdf1.21 MBAdobe PDFView/Open
09_chapter5.pdf2.12 MBAdobe PDFView/Open
10_conclusion.pdf227.04 kBAdobe PDFView/Open
11_annexures.pdf417.24 kBAdobe PDFView/Open
80_recommendation.pdf1.15 MBAdobe PDFView/Open
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