Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/567212
Title: An Investigation of WEDM process of doped silicon semi conductor wafer slicing through response surface methodology
Researcher: Singh, Raminder
Guide(s): Kumar, Anish
Keywords: Engineering
Engineering and Technology
Engineering Mechanical
University: Maharishi Markandeshwar University, Mullana
Completed Date: 2024
Abstract: Included
Pagination: 
URI: http://hdl.handle.net/10603/567212
Appears in Departments:Department of Mechanical Engineering

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01_title.pdfAttached File127.42 kBAdobe PDFView/Open
02_prelim_pages.pdf239.47 kBAdobe PDFView/Open
03_contents.pdf249.12 kBAdobe PDFView/Open
04_abstract.pdf91.03 kBAdobe PDFView/Open
05_chapter1.pdf381.97 kBAdobe PDFView/Open
06_chapter2.pdf295.24 kBAdobe PDFView/Open
07_chapter3.pdf515.45 kBAdobe PDFView/Open
08_chapter4.pdf1.21 MBAdobe PDFView/Open
09_chapter5.pdf2.12 MBAdobe PDFView/Open
10_conclusion.pdf227.04 kBAdobe PDFView/Open
11_annexures.pdf417.24 kBAdobe PDFView/Open
80_recommendation.pdf1.15 MBAdobe PDFView/Open
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