Physical Mechanical and Thermal Characterization of Hexagonal Boron Nitride and Sisal Fiber Reinforced Polyester Composites for Microelectronic Applications

Abstract

newline newlineThis thesis presents a comprehensive experimental investigation into the physical, mechanical, thermal, and dielectric properties of polyester-based composites. Divided into three parts, the study encompasses composites filled with micro-sized hexagonal boron nitride (hBN) and a hybrid variant combining hBN with short sisal fiber. The primary objective is to evaluate the potential of incorporating both ceramic fillers and natural fibers in the polymer matrix for the development of a hybrid composite suitable for microelectronic applications. The first part details raw materials, surface modification processes, and composite fabrication, including a thorough discussion of conducted experiments. The second part explores results from characterizing polyester filled with hBN, emphasizing properties in relation to filler loading, microstructural features, and the impact of hBN surface modification. The third part focuses on the hybrid composite, revealing increased void content and water absorption with the incorporation of hBN and sisal fiber. The hybrid combination enhances glass transition temperature and coefficient of thermal expansion, while mechanical properties and thermal conductivity see improvements with judiciously selected hybrid fillers. This research positions the polyester-based composites as promising candidates for diverse applications in microelectronic industries, offering heightened mechanical strength, enhanced thermal performance, and tailored dielectric characteristics.