Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/546297
Title: Fabrication of mems z axis accelerometer for vibration sensing
Researcher: Kalaiselvi, S
Guide(s): Sujatha, L
Keywords: Computer Science
Computer Science Information Systems
Engineering and Technology
University: Anna University
Completed Date: 2023
Abstract: Abnormal vibrations in rotating machines are indicative of undue newlinestresses in critical structural elements potentially leading to catastrophic newlinefailures. Consequently, measurement and characterization of vibration levels newlineprovides strong cues to detect anomalies and prevent failure. This work focuses newlineon development of a z-axis MEMS capacitive accelerometer for vibration newlinemeasurement. Optimal design and design-realization are two major steps to newlinebuild sensors for effective use in target application. Considering the design newlineaspect, planar MEMS structures for sensors usually have a large area compared newlineto thickness or gap. In such structures, squeeze film damping properties of the newlinegas significantly affects the performance of the device. Damping effects can be newlinereduced by perforations in the structure to reduce path-lengths of gas movement newlinein the narrow gap. But perforations in the proof mass reduce sensitivity, newlineTherefore, parameters enable trade-off between sensitivity and damping newlinecoefficient. This work studies different configurations of perforations for a newlinesquare accelerometer structure on a typical Silicon-on-Insulator substrate with newlineone µm air gap in the released structure. The ratio of perforation size versus newlineperforation pitch, and#414;, is used as a basis for comparing sensitivity and the damping newlinecoefficient. It is observed that and#414; in the range 0.3lt and#414; lt0.55 where the damping newlinecoefficient reduction is on the order of 90% to 97% while reduction in change newlinein capacitance is limited within 10% to 25%. Considering design-realization newlineprocesses, micro-machining of planar structures using photo-lithography and newlinewet-etching provides a simple and cost-effective approach. But wet-etching of newlinemono-crystalline Silicon exhibits anisotropic etch profile with erosion of newlineconvex corners of the planar structure. The resultant structure significantly newlinedeviates from the design leading to degradation in device performance. newline
Pagination: xxv,178p.
URI: http://hdl.handle.net/10603/546297
Appears in Departments:Faculty of Information and Communication Engineering

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01_title.pdfAttached File78.05 kBAdobe PDFView/Open
02_prelimpages.pdf3.19 MBAdobe PDFView/Open
03_content.pdf22.32 kBAdobe PDFView/Open
04_abstract.pdf78.76 kBAdobe PDFView/Open
05_chapter1.pdf767.19 kBAdobe PDFView/Open
06_chapter2.pdf438.46 kBAdobe PDFView/Open
07_chapter3.pdf1.8 MBAdobe PDFView/Open
08_chapter4.pdf482.25 kBAdobe PDFView/Open
09_chapter5.pdf752.06 kBAdobe PDFView/Open
10_chapter6.pdf1.11 MBAdobe PDFView/Open
11_chapter7.pdf881.21 kBAdobe PDFView/Open
12_chapter8.pdf792.63 kBAdobe PDFView/Open
13_annexures.pdf157.68 kBAdobe PDFView/Open
80_recommendation.pdf122.51 kBAdobe PDFView/Open
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