Analysis of thermal characteristics of epoxy based nano composites in electrical equipment

Abstract

Due to its many possibilities, epoxy resin has recently played a newlinesignificant role in the information and technology and industrial applications. newlineSignificant circuit boards including semiconductors, printed circuit boards newlinephotovoltaic arrays, and numerous other gadgets are made with it. Due to newlinetheir numerous applications, polymer-based compounds have gained newlinepopularity and are frequently utilised in the information and technology and newlineindustrial applications. Due to its high electrical conductivity, low dielectric newlineloss, and processability, it is utilised in the production of important electrical newlinecomponents such semiconductors, printed circuit boards, photovoltaic arrays, newlineand power inverters for electric and hybrid automobiles. The resins used most newlinefrequently in electronics and electrical purposes are epoxies. Epoxy resins are newlinechosen based on its excellent properties for adhesive, transparency, newlinecleanliness, and resistance to corrosion and tension. Generally, they are newlinepreferable to polyurethanes, silicones, alkyds, unbalanced polyesters, and newlinephenolics because they provide a better balance of physical and newlineelectromagnetic qualities. But the significantly lower operating temperatures newlineand electromagnetic instabilities of polymer-based materials prevent them newlinefrom meeting the rising needs of commercial processes. Electronic newlinecomponents benefit greatly from the development of technology for power newlineelectronics since it makes apparatus smaller and of top standard. Electronic newlinepower systems require dielectric materials for a number of functions, newlineincluding conversions, power stability, communications, etc. Composite newlinematerials, characterized as low molecular weight pre-polymers containing and newlineover one epoxide group, were first found and described in 1909 newline