Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/539138
Title: | Improvement of signal integrity in interconnects for high performance integrated circuit packaging system |
Researcher: | Deepthi, G |
Guide(s): | Madhavi, T |
Keywords: | Engineering Engineering and Technology Engineering Electrical and Electronic |
University: | GITAM University |
Completed Date: | 2023 |
Abstract: | File Attached |
Pagination: | |
URI: | http://hdl.handle.net/10603/539138 |
Appears in Departments: | Department of Electrical and Electronics Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 62.99 kB | Adobe PDF | View/Open |
02_prelim pages.pdf | 518.83 kB | Adobe PDF | View/Open | |
03_contents.pdf | 147.7 kB | Adobe PDF | View/Open | |
04_abstract.pdf | 53.38 kB | Adobe PDF | View/Open | |
05_chapter 1.pdf | 678.49 kB | Adobe PDF | View/Open | |
06_chapter 2.pdf | 620.93 kB | Adobe PDF | View/Open | |
07_chapter 3.pdf | 829.57 kB | Adobe PDF | View/Open | |
08_chapter 4.pdf | 389.88 kB | Adobe PDF | View/Open | |
09_chapter 5.pdf | 758.91 kB | Adobe PDF | View/Open | |
10_chapter 6.pdf | 556.74 kB | Adobe PDF | View/Open | |
11_chapter 7.pdf | 209.68 kB | Adobe PDF | View/Open | |
12_annexures.pdf | 310.89 kB | Adobe PDF | View/Open | |
80_recommendation.pdf | 271.69 kB | Adobe PDF | View/Open |
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