Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/539138
Title: Improvement of signal integrity in interconnects for high performance integrated circuit packaging system
Researcher: Deepthi, G
Guide(s): Madhavi, T
Keywords: Engineering
Engineering and Technology
Engineering Electrical and Electronic
University: GITAM University
Completed Date: 2023
Abstract: File Attached
Pagination: 
URI: http://hdl.handle.net/10603/539138
Appears in Departments:Department of Electrical and Electronics Engineering

Files in This Item:
File Description SizeFormat 
01_title.pdfAttached File62.99 kBAdobe PDFView/Open
02_prelim pages.pdf518.83 kBAdobe PDFView/Open
03_contents.pdf147.7 kBAdobe PDFView/Open
04_abstract.pdf53.38 kBAdobe PDFView/Open
05_chapter 1.pdf678.49 kBAdobe PDFView/Open
06_chapter 2.pdf620.93 kBAdobe PDFView/Open
07_chapter 3.pdf829.57 kBAdobe PDFView/Open
08_chapter 4.pdf389.88 kBAdobe PDFView/Open
09_chapter 5.pdf758.91 kBAdobe PDFView/Open
10_chapter 6.pdf556.74 kBAdobe PDFView/Open
11_chapter 7.pdf209.68 kBAdobe PDFView/Open
12_annexures.pdf310.89 kBAdobe PDFView/Open
80_recommendation.pdf271.69 kBAdobe PDFView/Open
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