Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/539138
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DC FieldValueLanguage
dc.coverage.spatial
dc.date.accessioned2024-01-11T11:38:30Z-
dc.date.available2024-01-11T11:38:30Z-
dc.identifier.urihttp://hdl.handle.net/10603/539138-
dc.description.abstractFile Attached
dc.format.extent
dc.languageEnglish
dc.relation
dc.rightsuniversity
dc.titleImprovement of signal integrity in interconnects for high performance integrated circuit packaging system
dc.title.alternative
dc.creator.researcherDeepthi, G
dc.subject.keywordEngineering
dc.subject.keywordEngineering and Technology
dc.subject.keywordEngineering Electrical and Electronic
dc.description.note
dc.contributor.guideMadhavi, T
dc.publisher.placeVisakhapatnam
dc.publisher.universityGITAM University
dc.publisher.institutionDepartment of Electrical and Electronics Engineering
dc.date.registered
dc.date.completed2023
dc.date.awarded2023
dc.format.dimensions
dc.format.accompanyingmaterialNone
dc.source.universityUniversity
dc.type.degreePh.D.
Appears in Departments:Department of Electrical and Electronics Engineering

Files in This Item:
File Description SizeFormat 
01_title.pdfAttached File62.99 kBAdobe PDFView/Open
02_prelim pages.pdf518.83 kBAdobe PDFView/Open
03_contents.pdf147.7 kBAdobe PDFView/Open
04_abstract.pdf53.38 kBAdobe PDFView/Open
05_chapter 1.pdf678.49 kBAdobe PDFView/Open
06_chapter 2.pdf620.93 kBAdobe PDFView/Open
07_chapter 3.pdf829.57 kBAdobe PDFView/Open
08_chapter 4.pdf389.88 kBAdobe PDFView/Open
09_chapter 5.pdf758.91 kBAdobe PDFView/Open
10_chapter 6.pdf556.74 kBAdobe PDFView/Open
11_chapter 7.pdf209.68 kBAdobe PDFView/Open
12_annexures.pdf310.89 kBAdobe PDFView/Open
80_recommendation.pdf271.69 kBAdobe PDFView/Open


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