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http://hdl.handle.net/10603/529375
Title: | Design and Development of Passive Substrate Integrated Waveguide Components |
Researcher: | Tharani, D |
Guide(s): | Selvajyothi, K and Karthikeyan, S S |
Keywords: | Engineering Engineering and Technology Engineering Electrical and Electronic |
University: | Indian Institute of Information Technology Design and Manufacturing Kancheepuram |
Completed Date: | 2023 |
Abstract: | Wireless communication systems are more crowded due to multiple standards (WLAN, WiMAX, 5G, etc). Because of this, there is a great demand for the design of multiband microwave passive devices such as filters, power dividers, diplexers, etc. These devices yield simultaneous operation at multiple frequencies, reduced area, and fabrication cost. Compact microwave components have gained much importance due to the miniaturization of modern wireless communication systems. This thesis investigates two methodologies to develop microwave components with multi-band functionality. One approach is the design of microwave components operating concurrently at several distinct bands, including the required frequencies. Another way is the development of component functioning over a wide and continuous band that covers the supporting frequency standards. newlineSubstrate Integrated Waveguide (SIW) technology bridges the performance gap between microstrip and waveguide. It has emerged as a potential platform to develop components with low loss, less expensive, compact size, and easy to fabricate and integrate. Hence SIW has gained considerable interest from the RF and microwave Engineers to develop compact and high-performance microwave components. By loading multiple complementary split-ring resonators (CSRRs) on the top of the SIW surface, multiple passbands are obtained below the SIW cut-off frequency. This method develops SIW-based compact multi-band microwave passive components. The slot-loading mechanism is deployed in the design of wideband microwave components. newline |
Pagination: | xxii, 135 |
URI: | http://hdl.handle.net/10603/529375 |
Appears in Departments: | Electrical and Electronics Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 68.36 kB | Adobe PDF | View/Open |
02_prelim pages.pdf | 405.82 kB | Adobe PDF | View/Open | |
03_content.pdf | 53.77 kB | Adobe PDF | View/Open | |
04_abstract.pdf | 47.92 kB | Adobe PDF | View/Open | |
05_chapter 1.pdf | 1.57 MB | Adobe PDF | View/Open | |
06_chapter 2.pdf | 274.72 kB | Adobe PDF | View/Open | |
07_chapter 3.pdf | 3.36 MB | Adobe PDF | View/Open | |
08_chapter 4.pdf | 6.46 MB | Adobe PDF | View/Open | |
09_chapter 5.pdf | 1.74 MB | Adobe PDF | View/Open | |
10_chapter 6.pdf | 51.04 kB | Adobe PDF | View/Open | |
11_annexures.pdf | 134.29 kB | Adobe PDF | View/Open | |
80_recommendation.pdf | 77.97 kB | Adobe PDF | View/Open |
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