Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/524209
Title: | Development of a Cu SAC305 based lead free solder joint interface with improved reliability and environmental stability |
Researcher: | Monalisa Char |
Guide(s): | Amit K Chakraborty and Abhijit Kar |
Keywords: | Physical Sciences Physics Physics Particles and Fields |
University: | National Institute of Technology Durgapur |
Completed Date: | 2022 |
Abstract: | newline |
Pagination: | |
URI: | http://hdl.handle.net/10603/524209 |
Appears in Departments: | Physics |
Files in This Item:
File | Description | Size | Format | |
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23 monalisa char ph.pdf | Attached File | 2.05 MB | Adobe PDF | View/Open |
80_recommendation.pdf | 47.43 kB | Adobe PDF | View/Open |
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