Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/524209
Title: Development of a Cu SAC305 based lead free solder joint interface with improved reliability and environmental stability
Researcher: Monalisa Char
Guide(s): Amit K Chakraborty and Abhijit Kar
Keywords: Physical Sciences
Physics
Physics Particles and Fields
University: National Institute of Technology Durgapur
Completed Date: 2022
Abstract: newline
Pagination: 
URI: http://hdl.handle.net/10603/524209
Appears in Departments:Physics

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