Numerical and Experimental Investigation on PCM Based Heat Sinks for Enhanced Electronic Cooling

Abstract

The field of thermal management is in a constant state of evolution. As electronic devices become even more intricate and demanding, thermal solutions must keep pace. Researchers are exploring novel materials with unprecedented thermal properties to further enhance heat transfer. Advanced manufacturing techniques, such as 3D printing and microfabrication, are being leveraged to create intricate heat sink designs that were once deemed unfeasible. Furthermore, dynamic control strategies that adapt cooling mechanisms in real-time are on the horizon, promising an even higher level of efficiency and control. The field of thermal management is in a constant state of evolution. As electronic devices become even more intricate and demanding, thermal solutions must keep pace. newline newlineThis Ph.D. thesis delves into the comprehensive investigation of PCM as a novel heat sink material for electronic cooling purposes. Further fins of different configurations and Nanoparticles are utilized as thermal conductive enhancers. The objective of this research is to investigate the efficiency of electronic cooling systems by utilizing heat sinks based on Phase Change Materials (PCMs) and Nano-Enhanced Phase Change Materials (NEPCMs). PCMs and NEPCMs present compelling alternatives to conventional cooling techniques due to their capacity to release and absorb substantial latent heat during phase changes, resulting in efficient heat dissipation. Computational simulations are conducted to optimize the heat sink geometry and enhance its overall thermal performance. To validate the experimental findings, a series of simulations are conducted using prototype PCM heat sinks. newline newlineThe integration of fins and nanoparticles in PCM heat sinks heralds a new era in electronic device cooling. As electronic components continue to shrink in size and increase in power density, efficient heat dissipation becomes paramount. The combined enhancements offered by fins and nanoparticles translate to tangible benefits such as improved device reliability, exte