Experimental Investigations into Slicing of Monocrystalline Silicon Ingot using Wire Electro discharge Machining

Abstract

Monocrystalline silicon wafers are crucial materials in the production of solar cells, semiconductors, integrated circuits, and sensors in the photovoltaic and electronics industries. The conventional methods used for slicing are diamond wire saw, fixed and loose abrasive wire saw, and inner diameter saw. But these methods have there on limitations such as saw marks, scratches, frequent edge chipping, high cost of diamond wire, high material loss, and low slicing rate. Also, the conventional slicing methods faces difficulties in efficient and precise slicing of these wafers due to their hardness and brittleness, leading to low yield and high costs. To overcome these challenges and provide superior slicing capabilities, alternative methods are necessary. Wire Electro discharge Machining (WEDM) has emerged as a promising method for slicing monocrystalline silicon due to its ability to achieve high precision, low material loss, and relatively better surface finish. newline newlineThis research work investigates the potential of WEDM as a cost-efficient and precise method for slicing monocrystalline silicon. newline