1. Shodhganga@INFLIBNET
  2. Indian Institute of Technology Bombay
  3. Department of Electrical Engineering
Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/492182
Title: True full duplex chip to chip interconnects and ios for high speed high density interfaces
Researcher: Goyal, Sandeep
Guide(s): Gupta, Shalabh
Keywords: Engineering
Engineering and Technology
Engineering Electrical and Electronic
University: Indian Institute of Technology Bombay
Completed Date: 2021
Abstract: Abstract attached newline newline
Pagination: NA
URI: http://hdl.handle.net/10603/492182
Appears in Departments:Department of Electrical Engineering

Files in This Item:
File Description SizeFormat 
01_title.pdfAttached File437.65 kBAdobe PDFView/Open
02_prelimpages.pdf787.18 kBAdobe PDFView/Open
03_abstract.pdf96.17 kBAdobe PDFView/Open
04_contents.pdf295.26 kBAdobe PDFView/Open
05_chapter_1.pdf359.18 kBAdobe PDFView/Open
06_chapter_2.pdf782.67 kBAdobe PDFView/Open
07_chapter_3.pdf554.95 kBAdobe PDFView/Open
08_chapter_4.pdf2.21 MBAdobe PDFView/Open
09_chapter_5.pdf13.55 MBAdobe PDFView/Open
10_chapter_6.pdf848.72 kBAdobe PDFView/Open
11_appendix.pdf6.6 MBAdobe PDFView/Open
80_recommendation.pdf150.65 kBAdobe PDFView/Open
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