Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/480040
Title: Quantitative Microwave Imaging Methods for Dielectric Profiling
Researcher: Anjit, T A
Guide(s): Mythili, P
Keywords: Compressive sensing
Deep Learning
Engineering
Engineering and Technology
Engineering Electrical and Electronic
Inverse scattering
Microwave imaging
University: Cochin University of Science and Technology
Completed Date: 2022
Abstract: newlineMicrowave Imaging (MWI), is an emerging modality that is being used as a diagnostic newlinetool in various applications such as ground-penetrating radar, synthetic aperture radar, newlinetarget identification, medical imaging etc. due to its unique features. Some of these newlineapplications require only qualitative information about the object under test. In newlinecontrast, many of applications needs a quantitative description of the scatterer, such as newlineits permittivity and conductivity profiles. The process of retrieving such features from newlinethe measured field values is known as Inverse Scattering Problem (ISP). The inverse newlinescattering problem (ISP) of microwave imaging is highly non-linear and ill-posed and newlineis liable to get stuck in local minima. The iterative techniques employed for solving newlinethese non-linear and ill-posed problems are computationally expensive. An attempt is newlinemade in this thesis to reconstruct the image cross-section of the object by determining newlinethe distribution of dielectric permittivities, from the scattered data measured around the newlineobject. Development of these methods begins with the formulation of the ISP by using newlineElectric Field Integral Equations (EFIE). The above modeled system of equations are newlinediscretized using Method of Moments (MoM) and a cost function is formulated in newlineterms of the field values. This cost function is solved in an iterative manner using Born newlineIterative Method (BIM) or Distorted Born Iterative Method (DBIM).
Pagination: xiv, 116
URI: http://hdl.handle.net/10603/480040
Appears in Departments:Department of Electronics & Communication

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02_preliminary pages.pdf170.57 kBAdobe PDFView/Open
03_content.pdf60.28 kBAdobe PDFView/Open
04_abstract.pdf47.77 kBAdobe PDFView/Open
05_chapter1.pdf1.03 MBAdobe PDFView/Open
06_chapter2.pdf150.75 kBAdobe PDFView/Open
07_chapter3.pdf1.24 MBAdobe PDFView/Open
08_chapter4.pdf3.78 MBAdobe PDFView/Open
09_chapter5.pdf10.17 MBAdobe PDFView/Open
10_chapter6.pdf121.44 kBAdobe PDFView/Open
14_annexures.pdf97.86 kBAdobe PDFView/Open
80_recommendation.pdf148.45 kBAdobe PDFView/Open
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