Experimental Investigations on Slicing Behaviour and Surface Texturization of Single Crystal Silicon

Abstract

Demand for solar energy shoot up in recent years due to its bountiful quantity compared with other energy sources. Single crystal silicon is one of the most widely used and highly demandable substrate materials in the solar and electronics industry to produce modern products because of its resoluteness and remarkable conversion efficiency. Slicing the silicon ingots without micro-cracks and other defacements is a tremendous challenge in the industry owing to its high hardness and brittleness. To overcome the above issues in slicing, non-traditional machining techniques like abrasive water jet machining (AWJM) were preferred to carry out the slicing process, which is flexible in the material removal process in hard and semiconductor materials used in electronic and solar components. In AWJM, not much work has been carried out with MWCNT mixed abrasives for slicing silicon ingots where it avoids distortion due to thermal and mechanical results in no transition in the properties like physical metallurgy of the work material newline