Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/462593
Title: | Heat Transfer and Flow Optimization in Heat Sinks for Different Al Cu Compositions |
Researcher: | Ramesha, H |
Guide(s): | Shivappa, D |
Keywords: | Engineering Engineering and Technology Engineering Mechanical |
University: | Visvesvaraya Technological University, Belagavi |
Completed Date: | 2021 |
Abstract: | All electronic equipment relies on the flow of and control of electrical newlinecurrent to perform a variety of functions. Whenever electrical current flows newlinethrough a resistive element, heat is generated. Regarding the appropriate newlineoperation of the electronics, heat dissipation is one of the most critical aspects newlineto be considered when designing an electronic box. Heat generation is an newlineirreversible process and heat must be removed in order to maintain the newlinecontinuous operation. With various degrees of sensitivity, the reliability and newlinethe performance of all electronic devices are temperature dependent. newlineGenerally, the lower the temperature and the change of temperature with newlinerespect to time, the better they are. Pure conduction, natural convection or newlineradiation cool the components to some extent whereas today s electronic newlinedevices need more powerful and complicated systems to cope with the heat. newlineTherefore, new heat sinks with larger extended surfaces, highly conductive newlinematerials and more coolant flow are keys to reducing the hot spots. newlineIn this study, forced cooling of heat sinks mounted on CPU s was newlineinvestigated. Heat sink effectiveness, the effect of turbulence models, the newlineeffect of radiation heat transfer and different heat sink geometries were newlinenumerically analysed by commercially available computational fluid newlinedynamics software Fluent. The numerical results were compared with the newlineexperimental data and they were in good agreement. Conjugate heat transfer newlineis simulated for all the electronic cards and packages by solving Navier-Stokes newlineequations. Grid independent, well converged and well-posed models were run newlineand the results were compared. The best heat sink geometry is selected and it newlineis modified in order to have lower maximum temperature distribution in the newlineheat sink newline |
Pagination: | 123 |
URI: | http://hdl.handle.net/10603/462593 |
Appears in Departments: | Department of Mechanical Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 242.51 kB | Adobe PDF | View/Open |
02_prelim pages.pdf | 377.72 kB | Adobe PDF | View/Open | |
03_content.pdf | 45.52 kB | Adobe PDF | View/Open | |
04_abstract.pdf | 74.17 kB | Adobe PDF | View/Open | |
05_chapter 1.pdf | 523.32 kB | Adobe PDF | View/Open | |
06_chapter 2.pdf | 1.76 MB | Adobe PDF | View/Open | |
07_chapter 3.pdf | 2.4 MB | Adobe PDF | View/Open | |
08_chapter 4.pdf | 392.14 kB | Adobe PDF | View/Open | |
10_annexures.pdf | 91.72 kB | Adobe PDF | View/Open | |
80_recommendation.pdf | 33.14 kB | Adobe PDF | View/Open |
Items in Shodhganga are licensed under Creative Commons Licence Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0).
Altmetric Badge: