Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/459266
Title: Development of high performance thermal conductive epoxy composite for thermal interface materials applications
Researcher: RAJESH KUMAR
Guide(s): SANJAY KUMAR NAYAK
Keywords: Engineering
Engineering and Technology
Engineering Chemical
University: Utkal University
Completed Date: 2019
Abstract: newline
Pagination: 
URI: http://hdl.handle.net/10603/459266
Appears in Departments:Department of Engineering

Files in This Item:
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01_title.pdfAttached File220.13 kBAdobe PDFView/Open
02_prelim pages.pdf4.59 MBAdobe PDFView/Open
03_content.pdf1.17 MBAdobe PDFView/Open
04_chapter1.pdf4.89 MBAdobe PDFView/Open
05_chapter2.pdf6.93 MBAdobe PDFView/Open
06_chapter3.pdf3 MBAdobe PDFView/Open
07_chapter4.pdf7.64 MBAdobe PDFView/Open
08_chapter5.pdf5.56 MBAdobe PDFView/Open
09_chapter6.pdf6.06 MBAdobe PDFView/Open
10_chapter7.pdf7.37 MBAdobe PDFView/Open
80_recommendation.pdf220.13 kBAdobe PDFView/Open
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