Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/459266
Title: | Development of high performance thermal conductive epoxy composite for thermal interface materials applications |
Researcher: | RAJESH KUMAR |
Guide(s): | SANJAY KUMAR NAYAK |
Keywords: | Engineering Engineering and Technology Engineering Chemical |
University: | Utkal University |
Completed Date: | 2019 |
Abstract: | newline |
Pagination: | |
URI: | http://hdl.handle.net/10603/459266 |
Appears in Departments: | Department of Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 220.13 kB | Adobe PDF | View/Open |
02_prelim pages.pdf | 4.59 MB | Adobe PDF | View/Open | |
03_content.pdf | 1.17 MB | Adobe PDF | View/Open | |
04_chapter1.pdf | 4.89 MB | Adobe PDF | View/Open | |
05_chapter2.pdf | 6.93 MB | Adobe PDF | View/Open | |
06_chapter3.pdf | 3 MB | Adobe PDF | View/Open | |
07_chapter4.pdf | 7.64 MB | Adobe PDF | View/Open | |
08_chapter5.pdf | 5.56 MB | Adobe PDF | View/Open | |
09_chapter6.pdf | 6.06 MB | Adobe PDF | View/Open | |
10_chapter7.pdf | 7.37 MB | Adobe PDF | View/Open | |
80_recommendation.pdf | 220.13 kB | Adobe PDF | View/Open |
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