Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/456211
Title: | Formulation of slurry for tantalum chemical mechanical planarization and its electrochemical characterization |
Researcher: | Shukla,Arpita |
Guide(s): | Manivannan,R and Victoria,S Noyel |
Keywords: | Chemical Engineering Chemical mechanical planarization Copper Engineering and Technology Material and removal Mechanism Tantalum |
University: | National Institute of Technology Raipur |
Completed Date: | 2022 |
Abstract: | Attached newline |
Pagination: | vii,123 |
URI: | http://hdl.handle.net/10603/456211 |
Appears in Departments: | Chemical Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
1_title.pdf | Attached File | 72.44 kB | Adobe PDF | View/Open |
2_preliminary pages.pdf | 806.01 kB | Adobe PDF | View/Open | |
3_contents.pdf | 131.24 kB | Adobe PDF | View/Open | |
4_abstract.pdf | 81.58 kB | Adobe PDF | View/Open | |
5_chapter 1.pdf | 513.66 kB | Adobe PDF | View/Open | |
6_chapter 2.pdf | 341.26 kB | Adobe PDF | View/Open | |
7_chapter 3.pdf | 950.42 kB | Adobe PDF | View/Open | |
80_recommendation.pdf | 153.28 kB | Adobe PDF | View/Open | |
8_chapter 4.pdf | 953.92 kB | Adobe PDF | View/Open | |
9_annexures.pdf | 1.07 MB | Adobe PDF | View/Open |
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