Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/456211
Title: Formulation of slurry for tantalum chemical mechanical planarization and its electrochemical characterization
Researcher: Shukla,Arpita
Guide(s): Manivannan,R and Victoria,S Noyel
Keywords: Chemical Engineering
Chemical mechanical planarization
Copper
Engineering and Technology
Material and removal Mechanism
Tantalum
University: National Institute of Technology Raipur
Completed Date: 2022
Abstract: Attached newline
Pagination: vii,123
URI: http://hdl.handle.net/10603/456211
Appears in Departments:Chemical Engineering

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1_title.pdfAttached File72.44 kBAdobe PDFView/Open
2_preliminary pages.pdf806.01 kBAdobe PDFView/Open
3_contents.pdf131.24 kBAdobe PDFView/Open
4_abstract.pdf81.58 kBAdobe PDFView/Open
5_chapter 1.pdf513.66 kBAdobe PDFView/Open
6_chapter 2.pdf341.26 kBAdobe PDFView/Open
7_chapter 3.pdf950.42 kBAdobe PDFView/Open
80_recommendation.pdf153.28 kBAdobe PDFView/Open
8_chapter 4.pdf953.92 kBAdobe PDFView/Open
9_annexures.pdf1.07 MBAdobe PDFView/Open
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