1. Shodhganga@INFLIBNET
  2. National Institute of Technology Raipur
  3. Chemical Engineering
Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/456211
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DC FieldValueLanguage
dc.coverage.spatial
dc.date.accessioned2023-02-06T06:19:21Z-
dc.date.available2023-02-06T06:19:21Z-
dc.identifier.urihttp://hdl.handle.net/10603/456211-
dc.description.abstractAttached newline
dc.format.extentvii,123
dc.languageEnglish
dc.relation
dc.rightsuniversity
dc.titleFormulation of slurry for tantalum chemical mechanical planarization and its electrochemical characterization
dc.title.alternative
dc.creator.researcherShukla,Arpita
dc.subject.keywordChemical Engineering
dc.subject.keywordChemical mechanical planarization
dc.subject.keywordCopper
dc.subject.keywordEngineering and Technology
dc.subject.keywordMaterial and removal Mechanism
dc.subject.keywordTantalum
dc.description.note
dc.contributor.guideManivannan,R and Victoria,S Noyel
dc.publisher.placeRaipur
dc.publisher.universityNational Institute of Technology Raipur
dc.publisher.institutionChemical Engineering
dc.date.registered2017
dc.date.completed2022
dc.date.awarded2022
dc.format.dimensions30 cm x 21 cm
dc.format.accompanyingmaterialNone
dc.source.universityUniversity
dc.type.degreePh.D.
Appears in Departments:Chemical Engineering

Files in This Item:
File Description SizeFormat 
1_title.pdfAttached File72.44 kBAdobe PDFView/Open
2_preliminary pages.pdf806.01 kBAdobe PDFView/Open
3_contents.pdf131.24 kBAdobe PDFView/Open
4_abstract.pdf81.58 kBAdobe PDFView/Open
5_chapter 1.pdf513.66 kBAdobe PDFView/Open
6_chapter 2.pdf341.26 kBAdobe PDFView/Open
7_chapter 3.pdf950.42 kBAdobe PDFView/Open
80_recommendation.pdf153.28 kBAdobe PDFView/Open
8_chapter 4.pdf953.92 kBAdobe PDFView/Open
9_annexures.pdf1.07 MBAdobe PDFView/Open
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