1. Shodhganga@INFLIBNET
  2. Indian Institute of Technology Hyderabad
  3. Department of Electrical Engineering
Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/454289
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DC FieldValueLanguage
dc.coverage.spatialElectrical Engineering
dc.date.accessioned2023-01-30T05:46:52Z-
dc.date.available2023-01-30T05:46:52Z-
dc.identifier.urihttp://hdl.handle.net/10603/454289-
dc.description.abstractAvailable newline newline
dc.format.extentxvii, 129 p.
dc.languageEnglish
dc.relationNA
dc.rightsuniversity
dc.titleLow thermal budget irreversible vertical bonding for high performance quartz resonator and inter die cooling applications
dc.title.alternativeNa
dc.creator.researcherHemanth Kumar, Cheemalamarri
dc.subject.keywordEngineering
dc.subject.keywordEngineering and Technology
dc.subject.keywordEngineering Electrical and Electronic
dc.description.noteReference page p. 112
dc.contributor.guideSingh, Shiv Govind and Vanjari, Siva Rama Krishna
dc.publisher.placeKandi
dc.publisher.universityIndian Institute of Technology Hyderabad
dc.publisher.institutionDepartment of Electrical Engineering
dc.date.registered2016
dc.date.completed2021
dc.date.awarded2021
dc.format.dimensionsNA
dc.format.accompanyingmaterialNone
dc.source.universityUniversity
dc.type.degreePh.D.
Appears in Departments:Department of Electrical Engineering

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