Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/454289
Title: Low thermal budget irreversible vertical bonding for high performance quartz resonator and inter die cooling applications
Researcher: Hemanth Kumar, Cheemalamarri
Guide(s): Singh, Shiv Govind and Vanjari, Siva Rama Krishna
Keywords: Engineering
Engineering and Technology
Engineering Electrical and Electronic
University: Indian Institute of Technology Hyderabad
Completed Date: 2021
Abstract: Available newline newline
Pagination: xvii, 129 p.
URI: http://hdl.handle.net/10603/454289
Appears in Departments:Department of Electrical Engineering

Files in This Item:
File Description SizeFormat 
01_title.pdfAttached File78.79 kBAdobe PDFView/Open
80_recommendation.pdf162.52 kBAdobe PDFView/Open
Show full item record


Items in Shodhganga are licensed under Creative Commons Licence Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0).

Altmetric Badge: