Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/454289
Title: | Low thermal budget irreversible vertical bonding for high performance quartz resonator and inter die cooling applications |
Researcher: | Hemanth Kumar, Cheemalamarri |
Guide(s): | Singh, Shiv Govind and Vanjari, Siva Rama Krishna |
Keywords: | Engineering Engineering and Technology Engineering Electrical and Electronic |
University: | Indian Institute of Technology Hyderabad |
Completed Date: | 2021 |
Abstract: | Available newline newline |
Pagination: | xvii, 129 p. |
URI: | http://hdl.handle.net/10603/454289 |
Appears in Departments: | Department of Electrical Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 78.79 kB | Adobe PDF | View/Open |
80_recommendation.pdf | 162.52 kB | Adobe PDF | View/Open |
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