Shodhganga : a reservoir of Indian theses @ INFLIBNET
The Shodhganga@INFLIBNET Centre provides a platform for research students to deposit their Ph.D. theses and make it available to the entire scholarly community in open access.
Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/449292
| Title: | Test and Recovery of Through Silicon Vias TSVs in Three Dimensional Integrated Circuits 3D ICs |
| Researcher: | Maity, Dilip Kumar |
| Guide(s): | Roy, Surajit Kumar |
| Keywords: | Computer Science Computer Science Information Systems Engineering and Technology |
| University: | Indian Institute of Engineering Science and Technology, Shibpur |
| Completed Date: | 2022 |
| Abstract: | Attached |
| Pagination: | 169 |
| URI: | http://hdl.handle.net/10603/449292 |
| Appears in Departments: | Department of Information Technology |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 01_title.pdf | Attached File | 174.56 kB | Adobe PDF | View/Open |
| 02_prelim pages.pdf | 308.03 kB | Adobe PDF | View/Open | |
| 03_content.pdf | 121.86 kB | Adobe PDF | View/Open | |
| 04-abstract.pdf | 54.38 kB | Adobe PDF | View/Open | |
| 05_chapter 1.pdf | 329.84 kB | Adobe PDF | View/Open | |
| 06_chapter 2.pdf | 228.12 kB | Adobe PDF | View/Open | |
| 07_chapter 3.pdf | 700.15 kB | Adobe PDF | View/Open | |
| 08_chapter 4.pdf | 1.04 MB | Adobe PDF | View/Open | |
| 09_chapter 5.pdf | 547.05 kB | Adobe PDF | View/Open | |
| 10_chapter 6.pdf | 730.01 kB | Adobe PDF | View/Open | |
| 11_chapter 7.pdf | 736.44 kB | Adobe PDF | View/Open | |
| 13_annexure.pdf | 174.93 kB | Adobe PDF | View/Open | |
| 80_recommendation.pdf | 249.28 kB | Adobe PDF | View/Open |
Items in Shodhganga are licensed under Creative Commons Licence Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0).
Altmetric Badge: