Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/440971
Title: Role of interstitials on thermal contact conductance across joints at cryogenic temperatures
Researcher: Reji Joseph
Guide(s): Asok Kumar N and Sunil Kumar S
Keywords: AA2219_ AISI 321_ Ti6Al4V thermal contact conductance
Cryogenic temperature_ Enhancement factor_ Hysteresis_ Rectifying factor
Engineering Aerospace_ Interstitial compounds
Engineering and Technology
Thermal contact conductance
University: University of Kerala
Completed Date: 2021
Abstract: newline
Pagination: 
URI: http://hdl.handle.net/10603/440971
Appears in Departments:Faculty of Engineering and Technology

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01_title.pdfAttached File263.92 kBAdobe PDFView/Open
02_prelim pages.pdf1.7 MBAdobe PDFView/Open
03_content.pdf359.32 kBAdobe PDFView/Open
04_abstract.pdf451.66 kBAdobe PDFView/Open
05_chapter 1.pdf951.36 kBAdobe PDFView/Open
06_chapter 2.pdf875.65 kBAdobe PDFView/Open
07_chapter 3.pdf444.4 kBAdobe PDFView/Open
08_chapter 4.pdf1.46 MBAdobe PDFView/Open
09_chapter 5.pdf4.19 MBAdobe PDFView/Open
10_chapter 6.pdf458.65 kBAdobe PDFView/Open
11_annexures.pdf1.88 MBAdobe PDFView/Open
80_recommendation.pdf716.75 kBAdobe PDFView/Open
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