Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/437269
Title: Optimization of process parameters for adhesive bonded joints and Rehabilitation of structures using adhesive bonding
Researcher: Chokka, Syam Kumar
Guide(s): Ben, B. Satish and Srinadh, K. V. Sai
Keywords: Engineering
Engineering and Technology
Engineering Mechanical
University: National Institute of Technology Warangal
Completed Date: 2021
Abstract: File Attached
Pagination: xvi, 93 p.
URI: http://hdl.handle.net/10603/437269
Appears in Departments:Department of Mechanical Engineering

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01_title.pdfAttached File81.47 kBAdobe PDFView/Open
02_prelim pages.pdf216.85 kBAdobe PDFView/Open
03_content.pdf36.2 kBAdobe PDFView/Open
04_abstract.pdf29.18 kBAdobe PDFView/Open
05_chapter 1.pdf190.44 kBAdobe PDFView/Open
06_chapter 2.pdf635.69 kBAdobe PDFView/Open
07_chapter 3.pdf512.43 kBAdobe PDFView/Open
08_chapter 4.pdf379.68 kBAdobe PDFView/Open
09_chapter 5.pdf1.11 MBAdobe PDFView/Open
10_chapter 6.pdf512.15 kBAdobe PDFView/Open
11_chapter 7.pdf388.15 kBAdobe PDFView/Open
12_chapter 8.pdf141.39 kBAdobe PDFView/Open
13_annexures.pdf152.91 kBAdobe PDFView/Open
80_recommendation.pdf207.96 kBAdobe PDFView/Open
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