Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/419396
Title: | Modelling and Extraction of Performance Parameters of On Chip High Speed Global VLSI Interconnects |
Researcher: | Garg, Narendra Kumar |
Guide(s): | Kushwah, Vivek Singh and Pattanaik, Manisha |
Keywords: | Engineering and Technology Engineering Electrical and Electronic |
University: | Amity University Madhya Pradesh |
Completed Date: | 2022 |
Abstract: | attached newline |
Pagination: | xiii, 139 |
URI: | http://hdl.handle.net/10603/419396 |
Appears in Departments: | Electronics And Communication Engineering |
Files in This Item:
File | Description | Size | Format | |
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80_recommendation.pdf | Attached File | 29.28 kB | Adobe PDF | View/Open |
certificates.pdf | 840.89 kB | Adobe PDF | View/Open | |
chapter-1 introduction.pdf | 494.45 kB | Adobe PDF | View/Open | |
chapter-2 literature review.pdf | 353.59 kB | Adobe PDF | View/Open | |
chapter-3 influence of interconnect dimensions.pdf | 627.64 kB | Adobe PDF | View/Open | |
chapter-4 rlc interconnects in domino circuit.pdf | 416.36 kB | Adobe PDF | View/Open | |
chapter-5 vlsi interconnects.pdf | 456.62 kB | Adobe PDF | View/Open | |
chapter-6 cross talk analysis in coupled.pdf | 307.14 kB | Adobe PDF | View/Open | |
chapter-7 conclusion and future scope.pdf | 23.21 kB | Adobe PDF | View/Open | |
plagarism report.pdf | 2.11 MB | Adobe PDF | View/Open | |
preliminary pages.pdf | 424.86 kB | Adobe PDF | View/Open | |
references.pdf | 129.35 kB | Adobe PDF | View/Open | |
title.pdf | 6.56 kB | Adobe PDF | View/Open |
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