Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/395939
Title: Optimization Algorithms for Thermal Aware Partitioning and Floorplanning of 3D ICs
Researcher: Jeya Prakash K
Guide(s): P Sivakumar
Keywords: Engineering
Engineering and Technology
Engineering Electrical and Electronic
University: Kalasalingam University
Completed Date: 2022
Abstract: newline
Pagination: 
URI: http://hdl.handle.net/10603/395939
Appears in Departments:Department of Electronics and Communication Engineering

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201408223_jeya prakash k_thesis_final.pdfAttached File3.51 MBAdobe PDFView/Open
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