Heat Transfer and Fluid Flow Analysis of Radial Type Micro Channel Heat Sink

Abstract

As there is development in the field of electronics, the miniaturization of newlineIntegrated Circuits (ICs) become the main area of interest for all the innovative minds newlineand researchers. Due to miniaturization the concentration of the ICs has increased newlinemultifold on the motherboard. With the increase in the concentration of ICs, heat newlinedissipation from microelectronics equipments is also an associated area of concern. More newlineand more work has started on the thermal management of the electronics equipment to newlinemake them efficient, reliable, and stable by modifying the designs of the heat sinks that newlineare used to dissipate the heat from the electronics product. Recently the high speed newlineintegrated circuits are in high demand in different segments of the engineering like newlineAeronautical Engineering, Electronics Engineering, Automotive Engineering Consumer newlineand Medical fields that generate high heat flux which in turn needs to be dissipated and newlinefor that reason sophisticated technologies to cool the substrate started evolving. Thermal newlineadministration has filled in as a key empowering innovation in the improvement of newlinecutting edge microelectronic frameworks and has encouraged huge numbers of the newlineadvances in buyer items and present day elite PCs and microelectronic frameworks. newline