Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/355753
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dc.coverage.spatialThe thesis results have demonstrated the suitability of proposed devices for the RF power amplifier applications
dc.date.accessioned2022-01-17T03:51:31Z-
dc.date.available2022-01-17T03:51:31Z-
dc.identifier.urihttp://hdl.handle.net/10603/355753-
dc.description.abstractLaterally diffused metal oxide semiconductor field effect transistors LDMOSFETs generally called LDMOS are widely used as power devices in the power integrated circuits PICs for many applications including automotive electronics personal communication systems portable power management systems and RF base stations The PICs provide various advantages like better reliability high performance low power consumption and reduction in volume weight and cost For RF power applications a better designed LDMOS should have high drive current ID large breakdown voltage Vbr low specific on resistance Ronsp high transconductance gm high cut off frequency fT and high maximum oscillation frequency fmax The trench technology is one of the design techniques used to enhance the performance of the LDMOS Presently silicon on insulator SOI technology is dominantly used for making the RF PICs due to its mature fabrication process with well studied native oxide As the silicon based power devices are approaching their physical limits new materials are needed to overcome the challenges faced by the Si technology The III V group compound semiconductors are emerging as the promising channel material for LDMOS due to their outstanding transport properties High electron mobility InGaAs is an attractive material which can replace Si in power devices Therefore motive of this work is to propose new LDMOS structures on SOI and InGaAs using trench technology for better performance the device In the proposed structures more than one channels are created in the p-base which carry drain current in parallel from drain to source This provides enhancement in current conduction and reduction in on resistance The proposed trench structures also achieve a better reduced surface field RESURF effect leading to higher breakdown voltage Further due to a simultaneous control of drain current by multiple gates the proposed LDMOS devices show higher transconductance leading to a better frequency response
dc.format.extent111 pages
dc.languageEnglish
dc.rightsuniversity
dc.titleDesign and Simulation of RF Power LDMOS on SOI and InGaAs
dc.title.alternative
dc.creator.researcherPayal Mohit
dc.subject.keywordEngineering
dc.subject.keywordEngineering and Technology
dc.subject.keywordEngineering Electrical and Electronic
dc.description.note
dc.contributor.guideSingh Yashvir
dc.publisher.placeDehradun
dc.publisher.universityUttarakhand Technical University
dc.publisher.institutionDepartment of Electronics and Communication Engineering
dc.date.registered2013
dc.date.completed2017
dc.date.awarded2021
dc.format.dimensions29x21x2 cm
dc.format.accompanyingmaterialCD
dc.source.universityUniversity
dc.type.degreePh.D.
Appears in Departments:Department of Electronics and Communication Engineering

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01-title page.pdfAttached File111.12 kBAdobe PDFView/Open
02-certificate page.pdf70.53 kBAdobe PDFView/Open
03-content.pdf6.14 kBAdobe PDFView/Open
04-list of table.pdf2.29 kBAdobe PDFView/Open
05-list of figures.pdf15.06 kBAdobe PDFView/Open
06-acknowledgment.pdf3.9 kBAdobe PDFView/Open
07-chapter 1.pdf71.94 kBAdobe PDFView/Open
08-chapter 2.pdf41.25 kBAdobe PDFView/Open
09-chapter 3.pdf181.86 kBAdobe PDFView/Open
10-chapter 4.pdf161.2 kBAdobe PDFView/Open
11-chapter 5.pdf142.61 kBAdobe PDFView/Open
12-chapter 6.pdf14.2 kBAdobe PDFView/Open
13-appendix.pdf2.15 kBAdobe PDFView/Open
14-references.pdf48.06 kBAdobe PDFView/Open
15-publication.pdf3.95 kBAdobe PDFView/Open
80_recommendation.pdf295.02 kBAdobe PDFView/Open


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