Effective cooling of vlsi circuits using nanofluids

Abstract

newlineElectronic devices and chips are an integral part of the technological development in all sectors and are helpful to accelerate their growth. Due to the continuous miniaturization and developments of design of VLSI Chip (Very Large-Scale Integration), the amount of heat generation is increasing per unit volume. The increase in thermal issues due to some of the few major reasons such as high electromigration and increasing the junction temperature caused by higher performance, current flow, and compact size. This increased temperature in the electronic chip also affects the other electronic components on its neighbor. This leads to failure in the electronic devices. Consequently, poor reliability significantly reduced lifetime of the semiconductor as well as increased power consumption. As a result, many researchers have proposed a variety of electronic cooling technologies like heat pipes, air coolers, thermoelectric modules, and refrigeration systems, etc. to enhance the heat transfer however they have reached their limitations. Therefore, it has become inevitable to develop an efficient heatsinks and heat transfer fluids capable of higher thermal conductivity and heat transfer so as to increase the processing speed of the electronic devices and VLSI Chip. newlineIn this research work, the new design structure and cooling methods have been proposed based on the few research gaps as mentioned. Three different structure of channel heat sink are designed and analyzed by using CATIA v5, and commercial CFD software (ANSYS FLUENT version12) respectively. The three different channel heat sinks are the Single-channel heatsink, Six-channel heatsink and Wave channel heat sink. This present research work was carried out with ordinary water, Al2O3/water, CuO/water, TiO2/water nanofluids as coolants in the Single-channel heat sink, Six-channel heatsink, and Wave channel heatsink at different volume concentration (0.25%, 0.50%, and 0.75%). newline newline