Design and development of defective ground structures to suppress common mode radiation on high speed printed circuit board

Abstract

The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips and transmission lines must be integrated with in a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is a right candidate to suppress common mode radiation on high speed printed circuit board. The aim of the research work is to propose a method of defective ground structures by varying the structural dimensions for reducing common mode radiation on high speed printed circuit board. This research work deals with the design, simulation, structure, fabrication and testing of modified defective ground structures for high speed printed circuit board application. This thesis proposes variants of defective ground structures namely, trident incurvature shape DGS, two C and E headed dumbbell DGS for high speed application. newline