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http://hdl.handle.net/10603/340623
Title: | Performance analysis of low power techniques for zigbee soc |
Researcher: | Parthiban, K |
Guide(s): | Sasikumar, s and Jayakumar, C |
Keywords: | Engineering and Technology Engineering Engineering Electrical and Electronic Performance analysis Electronic accessories |
University: | Anna University |
Completed Date: | 2020 |
Abstract: | In Real-time world, Electronic Accessories are a tremendous advantage in many fields for life safety and non-life safety processes. VLSI tools are used for portable devices such as computers, personal communication devices (Mobile Phones, Pagers, PDAs, and Tablets), hearing aids and pacemakers as well as growing exponentially in frequent fields. Earlier, the major concerns of the VLSI design were area, cost and performance. The power consumption of portable device was considered as secondary concern. In recent times, this trend has changed the focus on power consumption. Thus, power consumption is considered as one of the major concerns in VLSI circuit design. The problem of power dissipation in gate circuit has increased in direct proportion along with this development of technology. At the present time, VLSI chip can be used to design, fabricate and test in Application Specific Integrated Circuits (ASICs) as well as Field Programmable Gate Arrays (FPGAs) with a gate count of the order of a few tens of millions. Subsequently, this has led to the development of complex embedded System on Chip (SOC) for multiple applications. It has lots of challenges during manufacturing, testing and processing in modern field as per the International Technology Roadmap for Semiconductor (ITRS). The excessive power dissipation in integrated circuits discourage its usage in a portable device and also causes overheating which affects the system performance and life span of chip. One of the rising challenges in the modern trends of the innovative technologies is exploration for optimizing the power dissipation. The major factors that affect the battery up-time and its life are excessive power dissipation in the form of overheating. Hence, a reduction in this power dissipation and maintaining a nominal temperature within the circuits help endure the battery runtime and its life span. The power dissipation occurs mostly in the high end VLSI technology that is predominant newline |
Pagination: | xvi,113 p. |
URI: | http://hdl.handle.net/10603/340623 |
Appears in Departments: | Faculty of Information and Communication Engineering |
Files in This Item:
File | Description | Size | Format | |
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01_title.pdf | Attached File | 77.27 kB | Adobe PDF | View/Open |
02_certificates.pdf | 265.65 kB | Adobe PDF | View/Open | |
03_vivaproceedings.pdf | 153.85 kB | Adobe PDF | View/Open | |
04_bonafidecertificate.pdf | 391.76 kB | Adobe PDF | View/Open | |
05_abstracts.pdf | 252.5 kB | Adobe PDF | View/Open | |
06_acknowledgements.pdf | 783.75 kB | Adobe PDF | View/Open | |
07_contents.pdf | 166.28 kB | Adobe PDF | View/Open | |
08_listoftables.pdf | 177.38 kB | Adobe PDF | View/Open | |
09_listoffigures.pdf | 257.5 kB | Adobe PDF | View/Open | |
10_listofabbreviations.pdf | 178.62 kB | Adobe PDF | View/Open | |
11_chapter1.pdf | 585.46 kB | Adobe PDF | View/Open | |
12_chapter2.pdf | 558.17 kB | Adobe PDF | View/Open | |
13_chapter3.pdf | 683.67 kB | Adobe PDF | View/Open | |
14_chapter4.pdf | 657.92 kB | Adobe PDF | View/Open | |
15_chapter5.pdf | 1.77 MB | Adobe PDF | View/Open | |
16_chapter6.pdf | 1.79 MB | Adobe PDF | View/Open | |
17_conclusion.pdf | 1.8 MB | Adobe PDF | View/Open | |
18_references.pdf | 1.79 MB | Adobe PDF | View/Open | |
19_listofpublications.pdf | 390.2 kB | Adobe PDF | View/Open | |
80_recommendation.pdf | 63.87 kB | Adobe PDF | View/Open |
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