Heat transfer enhancement study on heat sink

Abstract

Heat sink is a passive heat exchanging device designed to absorb and drive away the heat generated from electronic or a mechanical device. The recent developments in electronic industry towards miniaturization of electronic packages and rapid increase in power density, the heat flux per unit area increases spectacularly. Enhancing efficiency of heat sink without increasing the size of the component is important in this era. Many researchers carried out experimental and numerical study to enhance the heat transfer in Heat sink by varying its physical shape, dimensions, fins orientation etc. The heat exchange from a heat sink depends on variable parameters such as cooling media and its atmospheric temperatures. The flow impingement, boundary layer separation, surface aerodynamic and turbulence also play major role for excavating heat from heat sink apart from physical structure variation. This paper conducted experimental study with three different approaches for heat transfer enhancement. 1. Effect of baffles attachment in Plate Fin Heat Sink (PFHS). Experimental study has been compared with CFD analysis for its degree of accuracy. 2. Effect of surface texture variation in Pin fin heat sink (PinFHS) and comparison with plain fin heat sink 3. Effect of Alumina balls addition in Phase Change Material (PCM) filled heat sink. newline newline newline