An heterogeneous investigation based on thermal problems of high density network on chips throughput enhancement

Abstract

Tremendous use of electronic system catalyzes to strive towards better performance augmentation for every now and then. The high demand in upgradation of sophisticated systems with on-chip circuits makes the semiconductor industry revolve around improved Quality of Services (QoS) like size, functionality, power dissipation, heat dissipation and so on. System-on-Chip (SoC) with most of its working units embedded on a chip which suffers from rigorous communication restraint could be resolved by providing Network-on-Chip (NoC). The proposed system is intended to progress heterogeneous services in NoC systems, specifically throughput and heat dissipation. The most significant variables of this study are throughput and heat decrease of the system, in which throughput is expressed and examined in terms of Flits/Cycle/entity and total number of received packets and decrease in temperature is expressed in degree centigrade and Kelvin. Throughput of the proposed system could be enhanced by taking up the advantage of adaptive routing technique. The improved number of data received and higher data transfer evidences the superior QoS in the simulation environment using Noxim Simulator. The proposed system derives the resultant throughput with a difference of at least 50% than the conventional routing methods in NoC. Alleviation of heat dissipation is achieved by the use of multichannel turbulent coolant flow with air as coolant. The simulation modeling through hotspot simulator, experimental results from working model and even computational Fluid Dynamics (CFD) simulation ensures nearly 10 degrees of temperature dip in the study area. The ten degrees of temperature decrease may elongate the lifetime of the electronic devices by twice as stated in Arrhenius equation. newline