Experimental investigations on Board level electronic packaging Subjected to dynamic loads

Abstract

Electronic equipment are more often subjected to severe vibration newlineenvironments such as sinusoidal random and mechanical shock during newlinehandling transportation Because of severe vibration environments the newlineprinted circuit boards PCB and electronic components mounted on it newlineexperiences high acceleration and displacement amplitudes when their newlinefundamental frequencies are excited In a lightly damped PCB assembly the newlinelevel of severity is still high and leads to early failure of component lead newlinewires cracking of PCB loosening of fastening screws and so on Therefore it newlineis very important to protect the PCB and the electronic devices mounted on it newlinefrom the harsh vibration environments by using simple vibration control newlinemethods newlineThe main objective of the present research work is to reduce the newlinetransmissibility ratios acceleration levels and displacement amplitudes in the newlineboard level electronic assemblies due to dynamic loads using the following newlinevibration control methods newline newline