Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/313967
Title: Design and Analysis of 4 Bit Sram Ternary Logic using CNTFET
Researcher: TAMIL SELVAN, S
Guide(s): SUNDARARAJAN, M
Keywords: Engineering
Engineering and Technology
Engineering Electrical and Electronic
University: Bharath University
Completed Date: 2020
Abstract: Design of 3VL memory portable usage of CNTFET. 3VL is a capable opportunity to standard binary common sense, as it has better overall concert in terms of place, energy and additionally decreases intersect postpone. The planned ternary memory cellular realizes a significant saving in vicinity as related with existing layout for the reason that and#955; policies are one of a kind for CNTFET. newlineIn addition to that, this bankruptcy is to extend CNFETs based SRAM and implement it right into a VHDLAMS. To acquire this purpose, a compact model of the transistor known as enhancement mode MOSFET-like SWCNT-CNFET is used. This circuitwell matched model of CNFET is described using VHDL-AMS and examined for simple electric uniqueness. This model is valid for CNFETs with channel lengths extra than 20nm. Based on the CNFETs a new SRAM is designed, and carried out in VHDL-AMS. The overall performance of the proposed SRAM mobile is investigated and in comparison with SRAMs from conventional MOSFETs. The effect of substrate biasing a CNFET is also confirmed and carried out in designing the SRAM cellular. The VHDL-AMS codes of the CNFET and the SRAM are simulated in software program called AnsoftSimplorer. The compact model of the CNFET is prepared hierarchically in three essential ranges. The first degree models the intrinsic channel simply beneath the gate of the transistor. The second level builds upon the first stage and fashions the doped supply and drain areas of the CNFET. The final stage represents the whole trans-capacitance version of the transistor and debts for more than one CNTs. The proposed SRAM cell is composed of 4 CNFETs and load resistors. The driver CNFETs of the proposed SRAM cell are substrate biased. Besides, eight-bit entire SRAM structure based on this cell is indicated. The performance analysis of the SRAM indicates that it has better writing and analyzing velocity as well as better stability whilst in comparison with SRAM from traditional MOSFETs. Specifically, the newly proposed SRAM mobile has read time of twenty 5 % seconds, write time of 20p.C.Seconds and might tolerate a noise of 120 mV at 32 nm node technology. newlineFurther a layout of a 3ValueLogic 9T reminiscence cell using CNTFETs. In 3VL judgment 9T memories portable based CNTFET were advanced and general HSPICE simulations had been finished in accurate situations. CNTFET 9T primarily based SRAM cellular proves which Dynamic electricity is better than CNTFET, primarily based 3value common sense 8T SRAM mobile in addition to CMOS SRAM cell. newlineFinally the aim is that, we have design of ternary 2x2 Sram reminiscence Array the usage of CNTFETs. The CNTFET technology has new parameters and characteristics which determine the performances such as current driving capability, speed, power consumption and area of circuits have been proposed for ternary 2x2 Sram memory array is needed to optimize performance using CNTFET technology. The CNTFET used for design has different charity vector and threshold voltages of CNTFET transistor can be controlled by controlling the chirality vector. The channel length used here is 32nm wide. The power consumption is reduce compare to CMOS technology Second order effects are removed by using CNTFET. In a 3 Value Logic also Trivalent, Ternary, Trinary Logic, or Trilean sometimes abbreviated 3VL), it only takes 0,1/2,1bits to represent a binary number. In 3Value logic 6T 2x2memory cell based CNTFET have been developed and extensive HSPICE simulations have been performed. The CNTFET based 3 value logic 6T ternary 2x2 SRAM array demonstrates that it provides low power dissipation and propagation delay which is better than CMOS 6T 2x2 SRAM array. newline newline
Pagination: 
URI: http://hdl.handle.net/10603/313967
Appears in Departments:Department of Electronics and Communication Engineering

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chapter 1.pdf735.11 kBAdobe PDFView/Open
chapter 2.pdf582.68 kBAdobe PDFView/Open
chapter 3.pdf793.88 kBAdobe PDFView/Open
chapter 4.pdf466.6 kBAdobe PDFView/Open
chapter 5.pdf1.18 MBAdobe PDFView/Open
chapter 6.pdf654.71 kBAdobe PDFView/Open
chapter 7.pdf315.75 kBAdobe PDFView/Open
preliminary pages.pdf700.55 kBAdobe PDFView/Open
references.pdf468.75 kBAdobe PDFView/Open
title page.pdf199.27 kBAdobe PDFView/Open
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