1. Shodhganga@INFLIBNET
  2. Savitribai Phule Pune University
  3. College of Engineering Pune
Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/312867
Title: Thermal mechanical and dielectric properties of polymer matrix micro and nanocomposites for electronics packaging
Researcher: Patki, Anita Manoj
Guide(s): Goyal, R K
Keywords: Electronics
Engineering
Engineering and Technology
Metallurgy
Metallurgy and Metallurgical Engineering
University: Savitribai Phule Pune University
Completed Date: 2019
Abstract: newline
Pagination: 
URI: http://hdl.handle.net/10603/312867
Appears in Departments:College of Engineering Pune

Files in This Item:
File Description SizeFormat 
01_title.pdfAttached File177.75 kBAdobe PDFView/Open
02_certificate.pdf468.31 kBAdobe PDFView/Open
03_declaration.pdf456.92 kBAdobe PDFView/Open
04_acknowledgements.pdf180.93 kBAdobe PDFView/Open
05_contents.pdf194.41 kBAdobe PDFView/Open
06_list_of_figures.pdf419.86 kBAdobe PDFView/Open
07_list_of_tables.pdf184.53 kBAdobe PDFView/Open
08_abbreviations.pdf308.57 kBAdobe PDFView/Open
09_abstract.pdf181.59 kBAdobe PDFView/Open
10_chapter 1.pdf154.48 kBAdobe PDFView/Open
11_chapter 2.pdf1.43 MBAdobe PDFView/Open
12_chapter 3.pdf907.5 kBAdobe PDFView/Open
13_chapter 4.pdf1.92 MBAdobe PDFView/Open
14_chapter 5.pdf1.33 MBAdobe PDFView/Open
15_chapter 6.pdf102.24 kBAdobe PDFView/Open
16_bibliography.pdf139.35 kBAdobe PDFView/Open
80_recommendation.pdf267.82 kBAdobe PDFView/Open
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