Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/26333
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dc.coverage.spatialhand held electronic devices subjected to random vibration and drop impact loadsen_US
dc.date.accessioned2014-10-07T04:29:08Z-
dc.date.available2014-10-07T04:29:08Z-
dc.date.issued2014-10-07-
dc.identifier.urihttp://hdl.handle.net/10603/26333-
dc.description.abstractElectronic equipmentdevices are subjected to many different forms newlineof vibration over wide frequency ranges and acceleration levels It is probably newlinesafe to say that all electronic equipment will be subjected to some type of newlinevibration at some time in life The vibrations are induced on electronic newlineequipment because of their active association with a machine or a moving newlinevehicle or due to transporting the equipment from the manufacturer to the newlinecustomer newlineThe handheld electronic equipment fit into the consumer and newlineportable market segments Handheld electronic equipment such as cameras newlinecalculators cell phones palm size personal computers PCs personal digital newlineassistants PDAs and other electronic equipment are conveniently stored in a newlinepocket and used while held in users hand newline newlineen_US
dc.format.extentxxv,177p.en_US
dc.languageEnglishen_US
dc.relationp.167-174en_US
dc.rightsuniversityen_US
dc.titleStudies on board level electronic packages used in hand held electronic devices subjected to random vibration and drop impact loadsen_US
dc.title.alternativeen_US
dc.creator.researcherSaravanan Sen_US
dc.subject.keywordboard level electronicen_US
dc.subject.keywordmechanical engineeringen_US
dc.subject.keywordrandom vibrationen_US
dc.description.noteReference p.167-174en_US
dc.contributor.guideMohanram P Ven_US
dc.publisher.placeChennaien_US
dc.publisher.universityAnna Universityen_US
dc.publisher.institutionFaculty of Mechanical Engineeringen_US
dc.date.registeredn.d.en_US
dc.date.completed01/12/2009en_US
dc.date.awarded30/12/2009en_US
dc.format.dimensions23cmen_US
dc.format.accompanyingmaterialNoneen_US
dc.source.universityUniversityen_US
dc.type.degreePh.D.en_US
Appears in Departments:Faculty of Mechanical Engineering

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01_title.pdfAttached File39 kBAdobe PDFView/Open
02_certificate.pdf5.81 kBAdobe PDFView/Open
03_abstract.pdf16.13 kBAdobe PDFView/Open
04_acknowledgement.pdf6.65 kBAdobe PDFView/Open
05_contents.pdf45.71 kBAdobe PDFView/Open
06_chapter 1.pdf499.31 kBAdobe PDFView/Open
07_chapter 2.pdf89.28 kBAdobe PDFView/Open
08_chapter 3.pdf615.21 kBAdobe PDFView/Open
09_chapter 4.pdf1.42 MBAdobe PDFView/Open
10_chapter 5.pdf1.89 MBAdobe PDFView/Open
11_chapter 6.pdf2.42 MBAdobe PDFView/Open
12_chapter 7.pdf38.39 kBAdobe PDFView/Open
13_references.pdf33.79 kBAdobe PDFView/Open
14_publications.pdf9.87 kBAdobe PDFView/Open
15_vitae.pdf5.91 kBAdobe PDFView/Open


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