Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/25343
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dc.coverage.spatialMechanical Engineeringen_US
dc.date.accessioned2014-09-22T09:33:33Z-
dc.date.available2014-09-22T09:33:33Z-
dc.date.issued2014-09-22-
dc.identifier.urihttp://hdl.handle.net/10603/25343-
dc.description.abstractExperimental and theoretical studies of the thermal performance of a variety of heat sinks with different base plates for enhancing heat dissipation rates in CPU have been undertaken The parameters such as fin pitch fin thickness base plate thickness and base plate materials are optimized for improving the thermal performance The thermal model of the computer system with a single cut plate fin heat sink design and other fin geometry newlinedesign is created using Gambit and the simulation is carried out using Fluent The experimental results of some simple geometry heat sinks have been compared to those predicted by a commercially available computational fluid dynamics code fluent In this research work the fin thickness is varied from 3mm to 5mm and also the fin pitch is varied from 1 5mm to 3 5mm The aluminum copper and carbon carbon composite materials are used as base plate of heat sink The base plate thickness of 2 5mm and 5mm are used Experimental results show that among the many design parameters the base newlineplate material has the most significant influence on the thermal performance of heat sinks The thermal performance of the heat sinks is increased up to 42 3 by employing ccc base plate newlineen_US
dc.format.extentxxiii, 168p.en_US
dc.languageEnglishen_US
dc.relation-en_US
dc.rightsuniversityen_US
dc.titleThermal analysis of plate fin heat sinks with base plates for CPU coolingen_US
dc.title.alternative-en_US
dc.creator.researcherMohan, Ren_US
dc.subject.keywordMechanical Engineeringen_US
dc.subject.keywordBase platesen_US
dc.subject.keywordCPU coolingen_US
dc.subject.keywordHeat sinksen_US
dc.subject.keywordMechanical engineeringen_US
dc.subject.keywordPlate fin heat sinksen_US
dc.subject.keywordThermal analysisen_US
dc.description.noteReference p.160-166, appendix p.153-159en_US
dc.contributor.guideSenthilkumar, Den_US
dc.publisher.placeChennaien_US
dc.publisher.universityAnna Universityen_US
dc.publisher.institutionFaculty of Mechanical Engineeringen_US
dc.date.registeredn.d.en_US
dc.date.completed01/11/2011en_US
dc.date.awarded30/11/2011en_US
dc.format.dimensions23cm.en_US
dc.format.accompanyingmaterialNoneen_US
dc.source.universityUniversityen_US
dc.type.degreePh.D.en_US
Appears in Departments:Faculty of Mechanical Engineering

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01_title.pdfAttached File129.65 kBAdobe PDFView/Open
02_certificates.pdf1.95 MBAdobe PDFView/Open
03_abstract.pdf6.8 kBAdobe PDFView/Open
04_acknowledgement.pdf6.13 kBAdobe PDFView/Open
05_contents.pdf40.83 kBAdobe PDFView/Open
06_chapter1.pdf679.3 kBAdobe PDFView/Open
07_chapter2.pdf80.41 kBAdobe PDFView/Open
08_chapter3.pdf243.75 kBAdobe PDFView/Open
09_chapter4.pdf4.76 MBAdobe PDFView/Open
10_chapter5.pdf3.71 MBAdobe PDFView/Open
11_chapter6.pdf53.59 kBAdobe PDFView/Open
12_appendix.pdf39.64 kBAdobe PDFView/Open
13_references.pdf23.17 kBAdobe PDFView/Open
14_publications.pdf6.94 kBAdobe PDFView/Open
15_vitae.pdf5.7 kBAdobe PDFView/Open


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