Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/196188
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DC FieldValueLanguage
dc.coverage.spatialInformation and Communication Engineering-
dc.date.accessioned2018-03-15T12:10:24Z-
dc.date.available2018-03-15T12:10:24Z-
dc.identifier.urihttp://hdl.handle.net/10603/196188-
dc.description.abstractAbstract available-
dc.format.extentxxxvi, 119p.-
dc.languageEnglish-
dc.relation110-117-
dc.rightsuniversity-
dc.titlePower integrity for through silicon via based three dimensional integrated circuits-
dc.creator.researcherV, Vinoth Thyagarajan-
dc.subject.keywordAnnular-
dc.subject.keywordCoazial-
dc.subject.keywordCylindrical-
dc.subject.keywordInsertion-
dc.subject.keywordTapered-
dc.description.noteData not available-
dc.contributor.guideRajaram, S-
dc.publisher.placeChennai-
dc.publisher.universityAnna University-
dc.publisher.institutionFaculty of Information and Communication Engineering-
dc.date.registeredn.d.-
dc.date.completed2016-
dc.date.awardedn.d.-
dc.format.dimensions8cm.-
dc.format.accompanyingmaterialNone-
dc.source.universityUniversity-
dc.type.degreePh.D.-
Appears in Departments:Faculty of Information and Communication Engineering

Files in This Item:
File Description SizeFormat 
01_title page.pdfAttached File22.39 kBAdobe PDFView/Open
02_certificate.pdf106.21 kBAdobe PDFView/Open
03_abstract.pdf12.85 kBAdobe PDFView/Open
04_acknowledgement.pdf6.4 kBAdobe PDFView/Open
05_table of content.pdf17.86 kBAdobe PDFView/Open
06_list of table.pdf4.83 kBAdobe PDFView/Open
07_list of figures.pdf22.61 kBAdobe PDFView/Open
08_list of symbols and abbreviations.pdf25.17 kBAdobe PDFView/Open
09_chapter 1.pdf519.55 kBAdobe PDFView/Open
10_chapter 2.pdf1.8 MBAdobe PDFView/Open
11_chapter 3.pdf1.11 MBAdobe PDFView/Open
12_chapter 4.pdf920.12 kBAdobe PDFView/Open
13_chapter 5.pdf22.81 kBAdobe PDFView/Open
14_references.pdf100.41 kBAdobe PDFView/Open
15_list of publication.pdf23.5 kBAdobe PDFView/Open


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