Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/196188
Title: | Power integrity for through silicon via based three dimensional integrated circuits |
Researcher: | V, Vinoth Thyagarajan |
Guide(s): | Rajaram, S |
Keywords: | Annular Coazial Cylindrical Insertion Tapered |
University: | Anna University |
Completed Date: | 2016 |
Abstract: | Abstract available |
Pagination: | xxxvi, 119p. |
URI: | http://hdl.handle.net/10603/196188 |
Appears in Departments: | Faculty of Information and Communication Engineering |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title page.pdf | Attached File | 22.39 kB | Adobe PDF | View/Open |
02_certificate.pdf | 106.21 kB | Adobe PDF | View/Open | |
03_abstract.pdf | 12.85 kB | Adobe PDF | View/Open | |
04_acknowledgement.pdf | 6.4 kB | Adobe PDF | View/Open | |
05_table of content.pdf | 17.86 kB | Adobe PDF | View/Open | |
06_list of table.pdf | 4.83 kB | Adobe PDF | View/Open | |
07_list of figures.pdf | 22.61 kB | Adobe PDF | View/Open | |
08_list of symbols and abbreviations.pdf | 25.17 kB | Adobe PDF | View/Open | |
09_chapter 1.pdf | 519.55 kB | Adobe PDF | View/Open | |
10_chapter 2.pdf | 1.8 MB | Adobe PDF | View/Open | |
11_chapter 3.pdf | 1.11 MB | Adobe PDF | View/Open | |
12_chapter 4.pdf | 920.12 kB | Adobe PDF | View/Open | |
13_chapter 5.pdf | 22.81 kB | Adobe PDF | View/Open | |
14_references.pdf | 100.41 kB | Adobe PDF | View/Open | |
15_list of publication.pdf | 23.5 kB | Adobe PDF | View/Open |
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