Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/116281
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DC FieldValueLanguage
dc.coverage.spatialChemistry
dc.date.accessioned2016-10-18T08:50:47Z-
dc.date.available2016-10-18T08:50:47Z-
dc.identifier.urihttp://hdl.handle.net/10603/116281-
dc.description.abstractAbstract not available newline newline
dc.format.extent240p.
dc.languageEnglish
dc.relation-
dc.rightsuniversity
dc.titleStudies on electroless copper deposition
dc.title.alternative-
dc.creator.researcherRekha, S
dc.subject.keywordElectroless Plating, Reducing Agents, Materials and Chemicals, Voltammetric, Polarization
dc.description.note-
dc.contributor.guideSrinivasan, K N
dc.publisher.placeTiruchirappalli
dc.publisher.universityBharathidasan University
dc.publisher.institutionDepartment of Chemistry
dc.date.registeredn.d.
dc.date.completed2007
dc.date.awardedn.d.
dc.format.dimensions-
dc.format.accompanyingmaterialNone
dc.source.universityUniversity
dc.type.degreePh.D.
Appears in Departments:Department of Chemistry

Files in This Item:
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01_title.pdfAttached File25.76 kBAdobe PDFView/Open
02_certificate.pdf31.53 kBAdobe PDFView/Open
03_declaration.pdf31.45 kBAdobe PDFView/Open
04_acknowledgment.pdf50 kBAdobe PDFView/Open
05_contents.pdf121.89 kBAdobe PDFView/Open
06_chapter 1.pdf974.67 kBAdobe PDFView/Open
07_chapter 2.pdf1.18 MBAdobe PDFView/Open
08_chapter 3.pdf1.2 MBAdobe PDFView/Open
09_chapter 4.pdf7.66 MBAdobe PDFView/Open
10_chapter 5.pdf173.59 kBAdobe PDFView/Open


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