Please use this identifier to cite or link to this item:
http://hdl.handle.net/10603/116281
Title: | Studies on electroless copper deposition |
Researcher: | Rekha, S |
Guide(s): | Srinivasan, K N |
Keywords: | Electroless Plating, Reducing Agents, Materials and Chemicals, Voltammetric, Polarization |
University: | Bharathidasan University |
Completed Date: | 2007 |
Abstract: | Abstract not available newline newline |
Pagination: | 240p. |
URI: | http://hdl.handle.net/10603/116281 |
Appears in Departments: | Department of Chemistry |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
01_title.pdf | Attached File | 25.76 kB | Adobe PDF | View/Open |
02_certificate.pdf | 31.53 kB | Adobe PDF | View/Open | |
03_declaration.pdf | 31.45 kB | Adobe PDF | View/Open | |
04_acknowledgment.pdf | 50 kB | Adobe PDF | View/Open | |
05_contents.pdf | 121.89 kB | Adobe PDF | View/Open | |
06_chapter 1.pdf | 974.67 kB | Adobe PDF | View/Open | |
07_chapter 2.pdf | 1.18 MB | Adobe PDF | View/Open | |
08_chapter 3.pdf | 1.2 MB | Adobe PDF | View/Open | |
09_chapter 4.pdf | 7.66 MB | Adobe PDF | View/Open | |
10_chapter 5.pdf | 173.59 kB | Adobe PDF | View/Open |
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