Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/116281
Title: Studies on electroless copper deposition
Researcher: Rekha, S
Guide(s): Srinivasan, K N
Keywords: Electroless Plating, Reducing Agents, Materials and Chemicals, Voltammetric, Polarization
University: Bharathidasan University
Completed Date: 2007
Abstract: Abstract not available newline newline
Pagination: 240p.
URI: http://hdl.handle.net/10603/116281
Appears in Departments:Department of Chemistry

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01_title.pdfAttached File25.76 kBAdobe PDFView/Open
02_certificate.pdf31.53 kBAdobe PDFView/Open
03_declaration.pdf31.45 kBAdobe PDFView/Open
04_acknowledgment.pdf50 kBAdobe PDFView/Open
05_contents.pdf121.89 kBAdobe PDFView/Open
06_chapter 1.pdf974.67 kBAdobe PDFView/Open
07_chapter 2.pdf1.18 MBAdobe PDFView/Open
08_chapter 3.pdf1.2 MBAdobe PDFView/Open
09_chapter 4.pdf7.66 MBAdobe PDFView/Open
10_chapter 5.pdf173.59 kBAdobe PDFView/Open
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