Please use this identifier to cite or link to this item: http://hdl.handle.net/10603/31730
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dc.coverage.spatialExperimental investigations on Board level electronic packaging Subjected to dynamic loadsen_US
dc.date.accessioned2014-12-26T05:01:10Z-
dc.date.available2014-12-26T05:01:10Z-
dc.date.issued2014-12-26-
dc.identifier.urihttp://hdl.handle.net/10603/31730-
dc.description.abstractElectronic equipment are more often subjected to severe vibration newlineenvironments such as sinusoidal random and mechanical shock during newlinehandling transportation Because of severe vibration environments the newlineprinted circuit boards PCB and electronic components mounted on it newlineexperiences high acceleration and displacement amplitudes when their newlinefundamental frequencies are excited In a lightly damped PCB assembly the newlinelevel of severity is still high and leads to early failure of component lead newlinewires cracking of PCB loosening of fastening screws and so on Therefore it newlineis very important to protect the PCB and the electronic devices mounted on it newlinefrom the harsh vibration environments by using simple vibration control newlinemethods newlineThe main objective of the present research work is to reduce the newlinetransmissibility ratios acceleration levels and displacement amplitudes in the newlineboard level electronic assemblies due to dynamic loads using the following newlinevibration control methods newline newlineen_US
dc.format.extentxxvii, 180p.p.en_US
dc.languageEnglishen_US
dc.relationp207-.en_US
dc.rightsuniversityen_US
dc.titleExperimental investigations on Board level electronic packaging Subjected to dynamic loadsen_US
dc.title.alternativeen_US
dc.creator.researcherSakri M Ien_US
dc.subject.keywordElectronic equipmenten_US
dc.subject.keywordPrinted circuit boardsen_US
dc.description.noteappendix 217-233, reference p207-213.en_US
dc.contributor.guideMohanram P Ven_US
dc.publisher.placeChennaien_US
dc.publisher.universityAnna Universityen_US
dc.publisher.institutionFaculty of Mechanical Engineeringen_US
dc.date.registeredn.d,en_US
dc.date.completed01/03/2009en_US
dc.date.awarded30/03/2009en_US
dc.format.dimensions23cm.en_US
dc.format.accompanyingmaterialNoneen_US
dc.source.universityUniversityen_US
dc.type.degreePh.D.en_US
Appears in Departments:Faculty of Mechanical Engineering

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01_title.pdfAttached File34.72 kBAdobe PDFView/Open
02_certificate.pdf5.76 kBAdobe PDFView/Open
03_abstract.pdf14.84 kBAdobe PDFView/Open
04_acknowledgement.pdf6.42 kBAdobe PDFView/Open
05_content.pdf54.73 kBAdobe PDFView/Open
06_chapter1.pdf252.35 kBAdobe PDFView/Open
07_chapter2.pdf189.57 kBAdobe PDFView/Open
08_chapter3.pdf2.28 MBAdobe PDFView/Open
09_chapter4.pdf1.27 MBAdobe PDFView/Open
10_chapter5.pdf906.75 kBAdobe PDFView/Open
11_chapter6.pdf782.51 kBAdobe PDFView/Open
12_chapter7.pdf1.6 MBAdobe PDFView/Open
13_chapter8.pdf557.99 kBAdobe PDFView/Open
14_chapter9.pdf66.52 kBAdobe PDFView/Open
15_appendix.pdf1.82 MBAdobe PDFView/Open
16_reference.pdf28.29 kBAdobe PDFView/Open
17_publication.pdf11.91 kBAdobe PDFView/Open
18_vitae.pdf5.49 kBAdobe PDFView/Open


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